(The position of the two Temp-sensor when soldering the
south/north board)
Features
1¡¢Adopt infrared weld technology which is developed
independently.
2¡¢Use infrared heat lamp. Heat is easy to pierce and distribute
evenly, which overcome disadvantage(burn out elements)
of traditional welder machines.
3¡¢Easy operation. Just need one-day training, you can
operation it skillfully.
4¡¢Don't need weld tools. IRDA Welder T870 can weld all
the elements between 35x35-50x50mm.
5¡¢This machine has 800W hot-melt system. Its preheating
area is 240x180mm.
6¡¢Infrared heating don't have sirocco flow. Don't impact
circumjacent small elements. It is suitable for all of
the elements. It can be used to unsolder BGA¡¢SMD¡¢CSP¡¢LGA¡¢QFP
and PLCC, especially Micro BGA and SMD elements.
7¡¢Definitely satisfy BGA unsoldering/repair of mobiles,
computers, notebooks, the electronic game machines and
so on; especially suits to the computer north and south
bridge chip¡£