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(The position of the two Temp-sensor when soldering the south/north board)

 

Features

1¡¢Adopt infrared weld technology which is developed independently.
2¡¢Use infrared heat lamp. Heat is easy to pierce and distribute evenly, which overcome disadvantage(burn out elements) of traditional welder machines.
3¡¢Easy operation. Just need one-day training, you can operation it skillfully.
4¡¢Don't need weld tools. IRDA Welder T870 can weld all the elements between 35x35-50x50mm.
5¡¢This machine has 800W hot-melt system. Its preheating area is 240x180mm.
6¡¢Infrared heating don't have sirocco flow. Don't impact circumjacent small elements. It is suitable for all of the elements. It can be used to unsolder BGA¡¢SMD¡¢CSP¡¢LGA¡¢QFP and PLCC, especially Micro BGA and SMD elements.
7¡¢Definitely satisfy BGA unsoldering/repair of mobiles, computers, notebooks, the electronic game machines and so on; especially suits to the computer north and south bridge chip¡£




 





 
 


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