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ACHI IR-3-welding BGA Rework,one of the double-way
dark infrared BGA repair equipment, is applied in the
chip-level welding and repairing of CBGA,CCGA,CSP,QFN,
MLF,PGA and all green epoxy colophony ¦ÌBGA and so on.The
main objective of the product design is for the chip BGA
repair and welding of notebook, desktop,switches,XBOX
and other games,communication mainboard and display card.
Features:
1.Double-way dark infrared heating system.It can heat
the top of components and the bottom of PCB at the same
time,which ensure heat distribution uniform and security.Compared
with the hot air heating,repairing process is more stable,it
can avoid uneven heating of the PCB board and cause warping.
2.Not need to replace or buy the heating nozzle,which
saves investment costs.
3.Heating from top to bottom independently and measure
temperature independently,from which the accurate, real-time
temperature parameters can be gotten.And the temperature
control more easily.
4.Be of alarm functions when the welding finishes.
5.No hot air flow in the repairing process.No affect to
the surrounding small components.
6.The top heating area: 80 mm ¡Á 80mm. BGA processing chip
surface area can be 50 mm ¡Á 50mm.The bottom preheating
of PCB board can be 420 mm ¡Á 300mm. Preheating process
is more uniform.
7.Repair heating temperature is 400¡æ,in which the lead-free
welding can be handled easily.
8.With laser positioning indicator,so the chip can align
in the process of repairing more accurately.
9.The spilt type adjustable BGA Rework fixture platform
can be moved and adjusted at will.A variety of ways orthopaedic
protect PCB board is not deformed after repairing.The
repair of large area or poor quality of the PCB board
is easier.
10.Fully considered the actual owners of maintenance in
research and development,production process.Reduce unnecessary
auxiliary functions, greatly reduce costs,which makes
it a high-quality,high success rate, cost-effective BGA
Rework platform.
11.With product manuals,hand-planted manuals presentation
video CDs. Easy-to-understand information, coupled with
the ease-of-use platform, even if you have never engaged
in repairing BGA you can also quickly grasped the technology.
Basic Parameters
| Heating
Way |
double-sided
dark infrared heating |
| Rework
Size |
370
mm ¡Á320 mm ¡Á255 mm |
| Rework
Weight |
9.6kg |
| Fixture
Size |
Independent
fixture, 450mm¡Á300mm¡Á160 mm |
| Fixture
Weight |
1.5kg |
| Package
Specification |
Vary
with the differen need of the users |
| Total
weight |
About
15 kg, vary with the differen need of the users |
Electrical Parameters
| Power supply |
220V AC |
| Types of
top heating elements |
Dark infrared
heating components |
| Size of
top heating components |
80mm¡Á80mm |
| Power of
top heating components |
300W |
| Types of
bottom heating components |
Dark infrared
heating components |
| Size of
bottom heating components |
180 mm¡Á180
mm |
| Power of
lower heating components |
600W |
| General
power |
950W |
Temperature control
| Control
of top heaer |
Iindependent
temperature control, high-precision closed-loop control,
instrumentation error ¡À 0.5%,alarm |
| Measure
temperature£¨top£© |
Highly Sensitive
K-temperature sensor, direct temperature monitoring |
| Contral
of bottom |
independent
temperature control, high-precision closed-loop |
| heater |
control,
instrumentation error of ¡À 0.5%, no alarm |
Measure
temperature£¨bottom£©
|
Highly Sensitive
K-temperature sensor, indirect temperature monitoring |
Rrework function
| Applicable
type |
Suit for
welding,remove or repair packaged devices such as
BGA,PBGA,CSP,multi-layer substrates and lead-free
welding |
| Size of
applicable chip |
¡Ü50mm¡Á50
mm |
| Size of
applicable PCB |
¡Ü420mm¡Á300 mm |
Other
| 1.Laser spotlights assisted
positioning. |
| 2.220 V top and bottom cooling
fan . |
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