¡ñ Innovative X Y axis adjustment method that simplifies the complex steps of focusing/positioning the BGA in the PCB.
¡ñ Microprocessor controlled with full digital display of time, temperature and airflow parameters for maximum performance.
¡ñ Uses split vision technology.
¡ñ Equipped with high precision optimizer that has dependable accuracy.
¡ñ With built-in high quality temperature sensor that ensures constant hot air temperature regardless of airflow variations.
¡ñ Can be programmed to automate reworking time for better control.
¡ñ Provides enough heat to handle even those with lead-free solders.
¡ñ Versatile PCB holder that has board capacity of up to 280 X 430mm.